D01 - Metallization and Integration

Monday, 10 October 2022: 14:00-16:00
Room 310 (The Hilton Atlanta)
Chairs:
Yue Kuo , Marleen H. van der Veen and Durga Misra
14:00
(Invited) Metallizations for Advanced Interconnects and Challenges for Future Nodes
M. H. van der Veen (imec), A. Delabie (University of Leuven, imec), N. Heylen, O. Varela Pedreira, N. Jourdan, S. Park, H. Struyf, and Z. Tokei (imec)
14:40
(Invited) Status of Room-Temperature Mass-Production Capability Plasma-Based Copper Etch Process
Y. Kuo (Texas A&M University)
15:20
Break
15:30
An Analysis on Different Single Diffusion Break Schemes for the Finfet
W. Tu (Semiconductor Manufacturing International Corporation), J. Qiu, Y. Wang, Y. Wang (SMIC), and H. Zhang (Semiconductor Equipment Association of Japan)
See more of: D01: Semiconductors, Dielectrics, and Metals for Nanoelectronics 19
See more of: Dielectric Science and Materials
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