In contrast with the Si-based semiconductors, deposition of wide bandgap insulators on the AlGaN and GaN surfaces is thought to be a plausible method for fabricating MOS gate stacks. Among the various insulating materials, Al2O3 and SiO2 exhibit a sufficiently wide bandgap and thermal stability for MOS device applications. However, it is well known that Al2O3 involves an essential problem of electron trapping, thus leading to significant Id-Vg hysteresis and Vth instability. In addition, poor electrical properties of GaN-based MOS devices have been reported even for the well-established ALD-Al2O3 and CVD-SiO2 films. We have investigated suitable insulating materials and deposition methods for AlGaN/GaN MOS-HFETs and GaN-MOSFETs. This paper reviews our recent findings on gate stack engineering for advanced GaN-based MOS devices and discusses a common guiding principle to improve device performance and reliability.
We implemented nitrogen incorporated Al2O3 (AlON) gate dielectrics into the AlGaN/GaN MOS-HFETs and successfully improved the performance and reliability of the devices. Our physical and electrical characterizations revealed superior thermal stability of the AlON/AlGaN interface and the importance of conducting dielectric deposition under a reactive nitric atmosphere to suppress intermixing at the interface. Recently, we demonstrated high current and high voltage (20A/730V) normally-off AlGaN/GaN MOS-HFETs with the AlON gate dielectrics.
For fabricating GaN-MOS structures, oxidation of the GaN surface is a fundamental method of obtaining gate insulators, but severe drawbacks, such as insufficient conduction band offset at GaOx/GaN interfaces and rough surface morphology have been pointed out. Thus, we proposed GaN-MOS structures with thin GaOx interlayers, in which oxide interlayers were formed by oxidation of GaN surface prior to SiO2 deposition. We also found that high-quality SiO2/GaOx/GaN stacked structures were formed by optimizing conditions for plasma-enhanced CVD of SiO2 films. Consequently, well-behaved C-V curves with negligible hysteresis and frequency dispersion were obtained. Moreover, an extremely low interface state density (< 1010 cm-2eV-1) and an improved reliability in terms of reproducibility and robustness against dielectric breakdown were achieved by rapid thermal annealing of SiO2/GaOx/GaN MOS devices.