G05 Poster Session

Tuesday, 2 October 2018: 18:00-20:00
Universal Ballroom (Expo Center)
1143
A Study on the Etching Residue of Nano-Scale Patterns in C4F8/CH2F2/O2/Ar Plasma
J. Lee, B. J. Lee (Korea University), H. W. Lee (Hanseo University), and K. H. Kwon (Korea University)
1144
Process Optimization for Electron Down-Flow Electromigration Improvement in Copper Interconnects
Y. L. Cheng and C. Y. Lee (National Chi-Nan University)
1145
Electromigration of Plasma Etched Copper Lines of Various Widths and Lengths
M. Li and Y. Kuo (Texas A&M University)
See more of: G05: Materials, Formulation, and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB
See more of: Electronic Materials and Processing
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