Electronic Materials and Processing

Sunday, 30 September 2018

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08:30-10:10

G03: SiGe, Ge, and Related Compounds: Materials, Processing, and Devices 8


Optoelectronics 1
Universal 13
Chair(s): Gianlorenzo Masini

10:30-12:20

G03: SiGe, Ge, and Related Compounds: Materials, Processing, and Devices 8


FET 1
Universal 13
Chair(s): Aaron Thean

14:00-15:40

G03: SiGe, Ge, and Related Compounds: Materials, Processing, and Devices 8


Optoelectronics 2
Universal 13
Chair(s): Gianlorenzo Masini

16:00-17:40

G03: SiGe, Ge, and Related Compounds: Materials, Processing, and Devices 8


FET 2
Universal 13
Chair(s): Aaron Thean

Monday, 1 October 2018

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08:00-09:00

G02: Atomic Layer Deposition Applications 14


Tutorial on Atomic Layer Etching
Universal 16
Chair(s): Fred Roozeboom

08:00-09:40

G01: Semiconductor Wafer Bonding: Science, Technology, and Applications 15


Bonding of Wide Bandgap Semiconductor
Universal 14
Chair(s): Helmut Baumgart and Frank NIklaus

G03: SiGe, Ge, and Related Compounds: Materials, Processing, and Devices 8


Optoelectronics 3
Universal 13
Chair(s): Gianlorenzo Masini

09:00-11:20

G05: Materials, Formulation, and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB


Semiconductor Process 1
Universal 15
Chair(s): Wei-Ping Dow, Masanori Hayase, Lingyun Wei, Kazuo Kondo, Fred Roozeboom, Gangadhara Mathad, Mitsumasa Koyanagi and Yasuhiko Takeno

09:00-12:00

G02: Atomic Layer Deposition Applications 14


Area Selective Deposition
Universal 16
Chair(s): Andrea Illiberi and J. W. Elam

10:00-11:40

G03: SiGe, Ge, and Related Compounds: Materials, Processing, and Devices 8


G03 Plenary
Universal 13
Chair(s): David L. Harame

10:20-12:00

G01: Semiconductor Wafer Bonding: Science, Technology, and Applications 15


Fundamental and Characterization
Universal 14
Chair(s): Karl D. Hobart and Vladimir Odnoblyudov

11:20-12:20

G05: Materials, Formulation, and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB


Processing Materials and Integration of Damascene and 3D Interconnects 9
Universal 15
Chair(s): Kazuo Kondo, T. Ritzdorf and Fred Roozeboom

12:00-12:40

G02: Atomic Layer Deposition Applications 14


History of Atomic Layer Deposition
Universal 16
Chair(s): Chanyuan Liu and Fred Roozeboom

13:00-14:30

G03: SiGe, Ge, and Related Compounds: Materials, Processing, and Devices 8


Related Compounds
Universal 13
Chair(s): Matty Caymax

14:00-15:20

G02: Atomic Layer Deposition Applications 14


Atomic Layer Deposition Materials
Universal 16
Chair(s): O. van der Straten and Stefan De Gendt

14:00-16:00

G01: Semiconductor Wafer Bonding: Science, Technology, and Applications 15


Adhesive, Anodic and Temporary Bonding
Universal 14
Chair(s): Roy Knechtel and François Rieutord

G05: Materials, Formulation, and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB


Semiconductor Process 2
Universal 15
Chair(s): Wei-Ping Dow, Kazuo Kondo, Lingyun Wei, Gangadhara Mathad, Mitsumasa Koyanagi, Fred Roozeboom and Yasuhiko Takeno

14:40-16:10

G03: SiGe, Ge, and Related Compounds: Materials, Processing, and Devices 8


Emerging Applications
Universal 13
Chair(s): Mikael Ostling

15:20-16:00

G02: Atomic Layer Deposition Applications 14


Emerging Atomic Layer Deposition Applications
Universal 16
Chair(s): Jolien Dendooven and O. van der Straten

18:00-20:00

G03: SiGe, Ge, and Related Compounds: Materials, Processing, and Devices 8


G03 Poster Session
Universal Ballroom
Chair(s): Jean-Michel Hartmann

Tuesday, 2 October 2018

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08:00-10:00

G01: Semiconductor Wafer Bonding: Science, Technology, and Applications 15


Sensors and MEMS
Universal 14
Chair(s): Todatomo Suga and Thomas Plach

08:00-12:20

G05: Materials, Formulation, and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB


PCB Process
Universal 15
Chair(s): Wei-Ping Dow, Kazuo Kondo, Gangadhara Mathad, Mitsumasa Koyanagi, Fred Roozeboom, Lingyun Wei and Yasuhiko Takeno

08:20-09:20

G02: Atomic Layer Deposition Applications 14


Tutorial on Precursor Design for Atomic Layer Processing
Universal 16
Chair(s): Fred Roozeboom

08:30-10:10

G03: SiGe, Ge, and Related Compounds: Materials, Processing, and Devices 8


FET 3
Universal 13
Chair(s): Aaron Thean

09:20-10:20

G02: Atomic Layer Deposition Applications 14


Atomic Layer Deposition Precursors
Universal 16
Chair(s): Charles H. Winter and Andrea Illiberi

10:20-12:00

G01: Semiconductor Wafer Bonding: Science, Technology, and Applications 15


Packaging and Metal Bonding
Universal 14
Chair(s): Chuan Seng Tan and Kazunari Kurita

10:20-12:40

G02: Atomic Layer Deposition Applications 14


Energy Storage Applications
Universal 16
Chair(s): Anil U. Mane and Jolien Dendooven

10:30-12:10

G03: SiGe, Ge, and Related Compounds: Materials, Processing, and Devices 8


HBT
Universal 13
Chair(s): Alvin Joseph

13:00-18:00

G05: Materials, Formulation, and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB


2.5D or 3D Chip Packaging Process
Universal 15
Chair(s): Wei-Ping Dow, Masanori Hayase, Lingyun Wei, Kazuo Kondo, Fred Roozeboom, Gangadhara Mathad, Mitsumasa Koyanagi and Yasuhiko Takeno

14:00-15:20

G02: Atomic Layer Deposition Applications 14


3D Structured Materials
Universal 16
Chair(s): Riikka L. Puurunen and Chanyuan Liu

14:00-15:40

G03: SiGe, Ge, and Related Compounds: Materials, Processing, and Devices 8


Epitaxy 1
Universal 13
Chair(s): Jean-Michel Hartmann

14:00-16:00

G01: Semiconductor Wafer Bonding: Science, Technology, and Applications 15


Integration and Dielectric Bonding
Universal 14
Chair(s): Frank Fournel and Subramanian Iyer

15:20-17:40

G02: Atomic Layer Deposition Applications 14


Atomic Layer Etching
Universal 16
Chair(s): Fred Roozeboom and Stefan De Gendt

16:00-17:40

G03: SiGe, Ge, and Related Compounds: Materials, Processing, and Devices 8


Surfaces and Interfaces 1
Universal 13
Chair(s): Seiichi Miyazaki and Paul C. McIntyre

18:00-20:00

G05: Materials, Formulation, and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB


G05 Poster Session
Universal Ballroom

19:00-21:00

G03: SiGe, Ge, and Related Compounds: Materials, Processing, and Devices 8


Evening Panel Workshop
Universal 13
Chair(s): Witek Maszara

Wednesday, 3 October 2018

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08:00-09:30

G04: Thermoelectric and Thermal Interface Materials 4


G04 Session 1
Universal 16
Chair(s): Jaeho Lee

08:00-10:00

G01: Semiconductor Wafer Bonding: Science, Technology, and Applications 15


Si, SiGe and III-V Bonding
Universal 14
Chair(s): Karl D. Hobart and Maik Wiemer

08:30-10:10

G03: SiGe, Ge, and Related Compounds: Materials, Processing, and Devices 8


Strain Engineering
Universal 13
Chair(s): Atsushi Ogura

09:00-11:20

G05: Materials, Formulation, and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB


Plasma Nanoscience and Nanotechnology 3
Universal 15
Chair(s): Dennis W. Hess and Oana Leonte

10:00-12:50

G04: Thermoelectric and Thermal Interface Materials 4


G04 Session 2
Universal 16
Chair(s): Colm O'Dwyer

10:20-12:00

G01: Semiconductor Wafer Bonding: Science, Technology, and Applications 15


Low Temperature and Surface Activated Bonding
Universal 14
Chair(s): Mark S. Goorsky and Kwang Hong Lee

10:30-12:30

G03: SiGe, Ge, and Related Compounds: Materials, Processing, and Devices 8


Processing
Universal 13
Chair(s): Andreas Mai

14:00-15:50

G03: SiGe, Ge, and Related Compounds: Materials, Processing, and Devices 8


Metrology
Universal 13
Chair(s): Andreas Schulze

14:00-16:00

G01: Semiconductor Wafer Bonding: Science, Technology, and Applications 15


Hermetic Packaging and Optical Devices
Universal 14
Chair(s): Roy Knechtel and Chuan Seng Tan

14:30-17:30

G04: Thermoelectric and Thermal Interface Materials 4


G04 Session 3
Universal 16
Chair(s): Colm O'Dwyer

16:10-17:50

G03: SiGe, Ge, and Related Compounds: Materials, Processing, and Devices 8


Epitaxy 2
Universal 13
Chair(s): Jean-Michel Hartmann

18:00-20:00

G04: Thermoelectric and Thermal Interface Materials 4


G04 Poster Session
Universal Ballroom

Thursday, 4 October 2018

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08:00-09:40

G03: SiGe, Ge, and Related Compounds: Materials, Processing, and Devices 8


Epitaxy 3
Universal 13
Chair(s): Jean-Michel Hartmann

10:00-11:40

G03: SiGe, Ge, and Related Compounds: Materials, Processing, and Devices 8


Surfaces and Interfaces 2
Universal 13
Chair(s): Seiichi Miyazaki and Paul C. McIntyre

13:20-15:00

G03: SiGe, Ge, and Related Compounds: Materials, Processing, and Devices 8


Epitaxy 4
Universal 13
Chair(s): Jean-Michel Hartmann

15:10-17:00

G03: SiGe, Ge, and Related Compounds: Materials, Processing, and Devices 8


Joint Session: Strain & Metrology & Characterization
Universal 13
Chair(s): Atsushi Ogura and Andreas Schulze