Semiconductor Process 2

Monday, 1 October 2018: 14:00-16:00
Universal 15 (Expo Center)
Chairs:
Wei-Ping Dow , Kazuo Kondo , Lingyun Wei , Gangadhara Mathad , Mitsumasa Koyanagi , Fred Roozeboom and Yasuhiko Takeno
14:00
1118
Low Temperature Microwave Anneal in FinFET Fabrication
J. Kassim, R. T. P. Lee, R. Krishnan, D. Ferrer (GLOBALFOUNDRIES Inc.), J. Yang (IBM Research), Y. Shusterman, I. Ramirez, H. Liu, J. Lui, and B. Krishnan (GLOBALFOUNDRIES Inc.)
14:20
1119
Self-Healing Effect of Wet-Processed Organic SAM Diffusion Barrier Layer Using Polymer Capped Palladium Nanoclusters
W. Y. Wang and T. C. Wei (National Tsing-Hua University)
14:40
1120
(Invited) Extendibility of Copper Metallization and Alternative Conductors in 7nm Node and Beyond
T. Nogami (IBM Research)
15:20
1121
A Study on the Diamond Wear Mechanism of Conditioner during W CMP in 3D NAND
D. W. Oh (Samsung Electronics)
15:40
1122
Size Estimation of Copper Plating Additives Using a High-Speed AFM
R. Ikuta, T. Akita, and M. Hayase (Tokyo University of Science)
See more of: G05: Materials, Formulation, and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB
See more of: Electronic Materials and Processing
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