Lead Organizer:
Wei-Ping Dow (National Chung Hsing University)
Co-organizers:
Gangadhara Mathad (Semiconductor Tech. Consulting)
,
Kazuo Kondo (Osaka Prefecture University)
,
Masanori Hayase (Tokyo University of Science)
,
Mitsumasa Koyanagi (Tohoku University)
,
Fred Roozeboom (Eindhoven University of Technology, TNO-Holst Centre)
,
Rohan Akolkar (Case Western Reserve University)
,
Silvia Armini (IMEC)
,
Yasuhiko Takeno (Global Net Corp.)
and
Lingyun Wei (The Dow Chemical Company)
Monday, 1 October 2018
09:00-11:20
Semiconductor Process 1
Universal 15
Chair(s): Wei-Ping Dow, Masanori Hayase, Lingyun Wei, Kazuo Kondo, Fred Roozeboom, Gangadhara Mathad, Mitsumasa Koyanagi and Yasuhiko Takeno
11:20-12:20
14:00-16:00
Semiconductor Process 2
Universal 15
Chair(s): Wei-Ping Dow, Kazuo Kondo, Lingyun Wei, Gangadhara Mathad, Mitsumasa Koyanagi, Fred Roozeboom and Yasuhiko Takeno
Tuesday, 2 October 2018
08:00-12:20
PCB Process
Universal 15
Chair(s): Wei-Ping Dow, Kazuo Kondo, Gangadhara Mathad, Mitsumasa Koyanagi, Fred Roozeboom, Lingyun Wei and Yasuhiko Takeno
13:00-18:00
2.5D or 3D Chip Packaging Process
Universal 15
Chair(s): Wei-Ping Dow, Masanori Hayase, Lingyun Wei, Kazuo Kondo, Fred Roozeboom, Gangadhara Mathad, Mitsumasa Koyanagi and Yasuhiko Takeno
18:00-20:00
Wednesday, 3 October 2018
09:00-11:20
