PCB Process

Tuesday, 2 October 2018: 08:00-12:20
Universal 15 (Expo Center)
Chairs:
Wei-Ping Dow , Kazuo Kondo , Gangadhara Mathad , Mitsumasa Koyanagi , Fred Roozeboom , Lingyun Wei and Yasuhiko Takeno
08:00
1123
(Invited) a Novel Metallization Process Using Slotogo As a Conducting Layer for HDI-Msap and Cu Pillar Applications
D. C. Yeh (Triallian Corporation)
08:40
1124
Using Copper Ion As the Catalyst Precursor of Electroless Copper Deposition on Polyimide Film
K. S. Li and W. P. Dow (National Chung Hsing University)
09:00
1125
Using Peg As a Suppressor for High Speed Copper Filling of Microvias
Y. C. Chiang and W. P. Dow (National Chung Hsing University)
09:20
1126
Electroless Deposition of Co-W-P on Polyimide Films for Enhancing the Adhesion of Followed Electroplated Copper Film
Y. Z. Hsieh and W. P. Dow (National Chung Hsing University)
09:40
Break
10:00
1127
(Invited) Fabrication of Copper/Carbon Nanotube Composite Films Using Plating Techniques
S. Arai (Shinshu University)
10:40
1128
A Breakthrough in Pb-Free Solder Electroplating
M. Balucani (Sapienza University of Rome - DIET, Rise Technology Srl) and S. Quaranta (Sapienza University of Rome - DIET)
11:00
1129
The Stability of Cu Electroless Deposition Solution Employing Copper Nanoparticle As the Catalyst
Y. C. Chen and W. P. Dow (National Chung Hsing University)
11:20
1130
Copper Superfilling without a Copper Pad at the Microvia Bottom Due to Reduced Graphene Oxide (rGO) Coating
Z. L. Yang and W. P. Dow (National Chung Hsing University)
11:40
1131
The Effect of Dual-Chelator on Cu Electroless Deposition Employing Cu Nanoparticles As the Catalyst
H. H. Lo and W. P. Dow (National Chung Hsing University)
12:00
1132
Using Electrochemically Exfoliated Graphene As a Conductive Layer of a Printed Circuit Board
S. W. Chang and W. P. Dow (National Chung Hsing University)
See more of: G05: Materials, Formulation, and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB
See more of: Electronic Materials and Processing
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