Hermetic Packaging and Optical Devices

Wednesday, 3 October 2018: 14:00-16:00
Universal 14 (Expo Center)
Chairs:
Roy Knechtel and Chuan Seng Tan
14:00
976
(Invited) Hermetic Wafer-Level Packaging of Microbolometers for Uncooled Thermal Cameras
Z. Abboud (École Polytechnique de Montréal, Teledyne DALSA Semiconductor), D. Chagnon, S. Assali, M. Fortin-Deschenes (École Polytechnique de Montréal), C. Coia (Teledyne DALSA Semiconductor), and O. Moutanabbir (École Polytechnique de Montréal)
14:40
977
Chemical Mechanical Polishing and Direct Bonding of YAG
M. S. Goorsky (University of California Los Angeles), J. McKay, and T. Bai (UCLA)
 
978
Direct Bonding of Stiff Glass Components with High Alignment Precision for Optical Applications in Space (Cancelled)
15:20
979
Collective Die Direct Bonding for Photonic on Silicon
L. Sanchez, F. Fournel, B. Montmayeul, L. Bally, B. Szelag, and L. Adelmini (Univ. Grenoble Alpes, CEA, LETI)
15:40
980
Atomic Diffusion Bonding for Optical Devices with High Optical Density
G. Yonezawa (Sony Corp.), Y. Takahashi (Sony Imaging Products & Solutions Inc.), Y. Sato (Sony Corp.), S. Abe (Sony Global Manufacturing & Operations Corp.), M. Uomoto (FRIS, Tohoku University), and T. Shimatsu (FRIS, Tohoku University, RIEC, Tohoku University)
See more of: G01: Semiconductor Wafer Bonding: Science, Technology, and Applications 15
See more of: Electronic Materials and Processing
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