G01 Semiconductor Wafer Bonding: Science, Technology, and Applications 15

Lead Organizer: Chuan Seng Tan (Nanyang Technological University)

Co-organizers: Tadatomo Suga (School of Engineering, Univ. Tokyo) , Helmut Baumgart (Old Dominion University, ECE Department) , Frank Fournel (Univ. Grenoble Alpes, CEA, LETI) , Mark S. Goorsky (University of California Los Angeles) , Karl D. Hobart (Naval Research Laboratory) and Roy Knechtel (X-FAB MEMS Foundry GmbH Erfurt)

Monday, 1 October 2018

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08:00-09:40


Bonding of Wide Bandgap Semiconductor
Universal 14
Chair(s): Helmut Baumgart and Frank NIklaus

10:20-12:00


Fundamental and Characterization
Universal 14
Chair(s): Karl D. Hobart and Vladimir Odnoblyudov

14:00-16:00


Adhesive, Anodic and Temporary Bonding
Universal 14
Chair(s): Roy Knechtel and François Rieutord

Tuesday, 2 October 2018

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08:00-10:00


Sensors and MEMS
Universal 14
Chair(s): Todatomo Suga and Thomas Plach

10:20-12:00


Packaging and Metal Bonding
Universal 14
Chair(s): Chuan Seng Tan and Kazunari Kurita

14:00-16:00


Integration and Dielectric Bonding
Universal 14
Chair(s): Frank Fournel and Subramanian Iyer

Wednesday, 3 October 2018

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08:00-10:00


Si, SiGe and III-V Bonding
Universal 14
Chair(s): Karl D. Hobart and Maik Wiemer

10:20-12:00


Low Temperature and Surface Activated Bonding
Universal 14
Chair(s): Mark S. Goorsky and Kwang Hong Lee

14:00-16:00


Hermetic Packaging and Optical Devices
Universal 14
Chair(s): Roy Knechtel and Chuan Seng Tan