Packaging and Metal Bonding

Tuesday, 2 October 2018: 10:20-12:00
Universal 14 (Expo Center)
Chairs:
Chuan Seng Tan and Kazunari Kurita
10:20
958
(Invited) A Moore’s Law for Packaging and the Role of Bonding
S. Iyer (University of California Los Angeles, University of California at Los Angeles)
11:00
959
Room Temperature Bonding of Electroformed Cu Based-Heat Spreader in Atmospheric Air
T. Matsumae, Y. Kurashima, and H. Takagi (AIST)
11:20
960
The Synergistic Roles of Temperature and Pressure in Thermo-Compression Bonding of Au
P. Ambhore, K. Mani, B. Beekley (University of California Los Angeles), N. Malik (University of Oslo), K. Schjølberg-Henriksen (SINTEF), S. Iyer, and M. S. Goorsky (University of California Los Angeles)
11:40
961
Electrical Characteristics of Solder-Free SiC Die/Metal Foil/AlN Plate Junctions Fabricated Using Surface Activated Bonding
S. Morita, J. Liang, and N. Shigekawa (Osaka City University)
See more of: G01: Semiconductor Wafer Bonding: Science, Technology, and Applications 15
See more of: Electronic Materials and Processing
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