(Invited) Water Transport Along Si/Si Direct Wafer Bonding Interfaces
F. Rieutord (CEA-INAC, Univ. Grenoble Alpes), S. Tardif (UGA, CEA, CNRS, INAC-MEM, 38000 Grenoble, France), I. Nikitskiy (Univ. Grenoble Alpes,CEA, INAC), F. Fournel (Univ. Grenoble Alpes, CEA, LETI), M. Tedjini, V. Larrey (Univ. Grenoble Alpes), C. Bridoux, C. Morales (CEA, LETI, MINATEC Campus), D. Landru (SOITEC, Parc Techno des Fontaines F-38190 Bernin, France), and O. Kononchuk (SOITEC)