Fundamental and Characterization

Hobart, Karl

Monday, 1 October 2018: 10:20-12:00

Universal 14 (Expo Center)

Chairs:

Karl D. Hobart and Vladimir Odnoblyudov

10:20

944

(Invited) Water Transport Along Si/Si Direct Wafer Bonding Interfaces

F. Rieutord (CEA-INAC, Univ. Grenoble Alpes), S. Tardif (UGA, CEA, CNRS, INAC-MEM, 38000 Grenoble, France), I. Nikitskiy (Univ. Grenoble Alpes,CEA, INAC), F. Fournel (Univ. Grenoble Alpes, CEA, LETI), M. Tedjini, V. Larrey (Univ. Grenoble Alpes), C. Bridoux, C. Morales (CEA, LETI, MINATEC Campus), D. Landru (SOITEC, Parc Techno des Fontaines F-38190 Bernin, France), and O. Kononchuk (SOITEC)

11:00

945

Bonding Yield Analysis of Enclosed Structures

J. Visker (Imec), G. Fiorentino, and L. Peng (imec)

11:20

946

Impact of Multiple Debonding on Adhesion Energy

F. Fournel, V. Larrey (Univ. Grenoble Alpes, CEA, LETI), F. Rieutord (Univ. Grenoble Alpes, CEA, INAC, MEM), C. Morales, C. Bridoux, G. Mauguen, and S. Lobo (Univ. Grenoble Alpes, CEA, LETI)

11:40

947

Characterization of Wafer-Bonded Oxide-Free Silicon with Surfaces Treated with an Ion-Bombardment Procedure

M. Liao, C. Li (University of California, Los Angeles), C. Flötgen (EV Group), and M. S. Goorsky (University of California Los Angeles)

See more of: G01: Semiconductor Wafer Bonding: Science, Technology, and Applications 15
See more of: Electronic Materials and Processing

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