Sensors and MEMS

Tuesday, 2 October 2018: 08:00-10:00
Universal 14 (Expo Center)
Chairs:
Todatomo Suga and Thomas Plach
08:00
953
(Invited) Proximity Gettering Design of Hydrocarbon Molecular Ion Implanted Silicon Wafers Using Direct Bonding Technique for Advanced CMOS Image Sensors: A Review
K. Kurita, Y. Koga, R. Okuyama, T. Kadono, S. Shigematsu, A. O. Masada, R. Hirose, and H. Okuda (SUMCO CORPORATION)
08:40
954
Multilayer Thin Film Getter for Sustainable Vacuum in MEMS Packaging
M. WU (Department of Microelectronics, Soochow University, C2N, CNRS / Univ. Paris Sud / Univ. Paris Saclay), J. Moulin, and A. Bosseboeuf (C2N, CNRS / Univ. Paris Sud / Univ. Paris Saclay)
09:00
955
SiC Wafer Bonding and Deep Reactive Ion Etching Towards High-Aspect Ratio SiC MEMS Fabrication
L. E. Luna (U.S. Naval Research Laboratory), K. D. Hobart (Naval Research Laboratory), M. J. Tadjer (U.S. Naval Research Laboratory), R. L. Myers-Ward (U.S. Naval Research Laboratory, Washington DC), T. J. Anderson (NRL), and F. J. Kub (Naval Research Laboratory)
09:20
956
Miniaturized Two Axis Acceleration Sensor Using Direct and Anodic Wafer Bonding for an Implantable Sensor Unit
M. Wiemer, D. Wuensch, T. Schroeder, M. Baum, and T. Otto (Fraunhofer Institute for Electronic Nanosystems)
09:40
957
Glass Frit Wafer Bonding for Encapsulating Monolithic Integrated CMOS-MEMS Devices
R. Knechtel (X-FAB MEMS Foundry GmbH Erfurt), M. Zellmer, M. Schikowski, M. Behmueller (X-FAB MEMS Foundry Itzehoe GmbH), C. Van Buggenhout (Melexis NV, Ieper, Belgium), and A. Petropoulos (Melexis Technologies NV, Tessenderlo, Belgium)
See more of: G01: Semiconductor Wafer Bonding: Science, Technology, and Applications 15
See more of: Electronic Materials and Processing
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