861
Three-Dimensional Dopant/Carrier Profiling

Tuesday, May 14, 2013: 09:00
Norfolk, Mezzanine Level (Sheraton)
Wilfried Vandervorst , KULeuven, Leuven, Belgium
A. Schulze , Imec
Ajay Kumar Kambham , imec
J. Mody , imec
M. Gilbert , imec
P. Eyben , imec

Abstract:

  • E5-0861 (695.1KB) - Abstract Text
See more of: Non-Planar Devices: FINFETS/Nanowires
See more of: E5: Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 3
See more of: Dielectric and Semiconductor Materials, Devices, and Processing
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