E5 Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 3
E5 Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 3
Sponsor(s):
Electronics and Photonics,
Dielectric Science and Technology
Lead Organizer: F. Roozeboom (University of Technology)
Co-organizers: E. P. Gusev (Qualcomm MEMS Technologies) , Hiroshi Iwai (Tokyo University of Technology) , Kuniyuki Kakushima (Tokyo Institute of Technology) , D.-L. Kwong (Institute of Microelectronics) , Vijay Narayanan (IBM T.J. Watson Research Center) and P. J. Timans (Mattson Technology Inc.)