2117
Advanced Wafer Drying Technology for 1x Node and Beyond Using Surface Modification Method
Tuesday, October 29, 2013: 15:00
Continental 8, Tower 3, Ballroom Level (Hilton San Francisco Union Square)
Tsukasa Watanabe
,
Technology Development Center, Tokyo Electron Kyushu Limited., Nirasaki-city, Japan
Takayuki Toshima
,
Technology Development Center, Tokyo Electron Kyushu Limited., Nirasaki, Japan
Mitsunori Nakamori
,
SPE Process Technology Department, Tokyo Electron Kyushu Limited
Keisuke Egashira
,
Technology Development Center, Tokyo Electron Kyushu Limited.
Yasuyuki Ido
,
Technology Development Center, Tokyo Electron Kyushu Limited.
Nobuaki Matsumoto
,
Surface Preparation Systems Marketing Department Tokyo Electron Limited
Takehiko Orii
,
Technology Development Center, Tokyo Electron Kyushu Limited., Nirasaki, Japan
