Wafer Drying and Wetting Issues
Tuesday, October 29, 2013: 14:00-16:00
Continental 8, Tower 3, Ballroom Level (Hilton San Francisco Union Square)
Chairs:
Richard E. Novak
and
Guy Vereecke
14:00
(Invited) Wetting Behavior of Aqueous Solutions on High Aspect Ratio Nanopillars with Hydrophilic Surface Finish
Guy Vereecke, imec;
XiuMei Xu, Ph.D., imec;
Wei-Kang Tsai, M.Eng., University of Southern California;
Hui Yang, K.U. Leuven;
Silvia Armini, Ph.D., imec;
Tinne Delande, M.Eng., imec;
Geert Doumen, M.Eng., imec;
Frank Kentie, M.Eng., Katholieke Universiteit Leuven;
Xiaoping Shi, Ph.D., imec;
Ihsan Simms, Tokyo Electron;
Kathleen Nafus, Tokyo Electron;
Frank Holsteyns, imec;
Herbert Struyf, Ph.D., imec;
Stefan De Gendt, IMEC
14:40
Watermark Formation Mechanism by Evaporation of Ultra-Pure Water: Study the Effect of Ambient
Amir-Hossein Tamaddon, PhD student, imec;
Paul W. Mertens, imec;
Guy Vereecke, imec;
Frank Holsteyns, imec;
Geert Doumen, Master of Eng., imec;
Stefan De Gendt, KULeuven;
Marc Heyns, PhD, KU Leuven
15:00
Advanced Wafer Drying Technology for 1x Node and Beyond Using Surface Modification Method
Tsukasa Watanabe, Technology Development Center, Tokyo Electron Kyushu Limited.;
Takayuki Toshima, Technology Development Center, Tokyo Electron Kyushu Limited.;
Mitsunori Nakamori, SPE Process Technology Department, Tokyo Electron Kyushu Limited;
Keisuke Egashira, Technology Development Center, Tokyo Electron Kyushu Limited.;
Yasuyuki Ido, Technology Development Center, Tokyo Electron Kyushu Limited.;
Nobuaki Matsumoto, Surface Preparation Systems Marketing Department Tokyo Electron Limited;
Takehiko Orii, Technology Development Center, Tokyo Electron Kyushu Limited.
