2062
Using Graphene As a Conducting Layer for Through Silicon Via Filling

Monday, October 28, 2013: 16:20
Union Square 21, Tower 3, 4th Floor (Hilton San Francisco Union Square)
Shih-Cheng Chang, master , National Chung Hsing University Department of Chemical Engineering, Taichung, Taiwan
Wei-Ping Dow , National Chung Hsing University

Abstract:

  • E7-2062 (120.7KB) - Abstract Text
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