2071
A Novel Cu Plating Formula for Filling Through Holes

Tuesday, October 29, 2013: 11:00
Union Square 21, Tower 3, 4th Floor (Hilton San Francisco Union Square)
Yu-Tien Lin, bachelor , Department of Chemical Engineering at National Chung Hsing University　, Taichung, Taiwan
Jhih-Jyun Yan, Master , Department of Chemical Engineering National Chung Hsing University
Wei-Ping Dow , National Chung Hsing University

Abstract:

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