2075
Effect of Bath Chemistry On Electrodeposited Cu Morphology Using Thin PVD Cu Seed

Tuesday, October 29, 2013: 14:20
Union Square 21, Tower 3, 4th Floor (Hilton San Francisco Union Square)
James Kelly , IBM Research, Albany, NY
Xuan Lin , Globalfoundries
Takeshi Nogami , IBM Research
O. van der Straten , IBM Research
James Demarest , IBM Microelectronics
Juntao Li , IBM Microelectronics
Richard Murphy , IBM Microelectronics
Patrick DeHaven , IBM Microelectronics
Xunyuan Zhang , Globalfoundries
Christopher Penny , IBM Microelectronics
Q. Huang , IBM, T. J. Watson Research Center
Daniel Edelstein , IBM Research

Abstract:

  • E7-2075 (873.0KB) - Abstract Text
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