2076
Novel Alkaline Copper and Copper-Alloy Electroplating Processes Offering Extended Capabilities in Semiconductor Interconnect Metallization

Tuesday, October 29, 2013: 14:40
Union Square 21, Tower 3, 4th Floor (Hilton San Francisco Union Square)
Aniruddha Joi , Case Western Reserve University, Cleveland, OH
Rohan Akolkar , A.W. Smith Bldg, Room 127, Case Western Reserve University, Cleveland, OH
Uziel Landau , Case Western Reserve University

Abstract:

  • E7-2076 (977.8KB) - Abstract Text
See more of: Copper Damascene Interconnections
See more of: E7: Processing, Materials, and Integration of Damascene and 3D Interconnects 5
See more of: Dielectric and Semiconductor Materials, Devices, and Processing
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