2087
Screening Techniques for Selecting Improved Additives for Bottom-Up Copper Metallization

Wednesday, October 30, 2013: 09:20
Union Square 21, Tower 3, 4th Floor (Hilton San Francisco Union Square)
Lindsay Boehme , Case Western Reserve University, Cleveland Heights, OH
Uziel Landau , Case Western Reserve University

Abstract:

  • E7-2087 (119.5KB) - Abstract Text
See more of: Copper Electrodeposition Fundamentals
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See more of: Dielectric and Semiconductor Materials, Devices, and Processing
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