2086
Cuprous Ion As An Accelerant of Copper Damascene Electrodeposition

Wednesday, October 30, 2013: 09:00
Union Square 21, Tower 3, 4th Floor (Hilton San Francisco Union Square)
Kazuo Kondo, Ph.D. , Osaka Prefecture University, Sakai, Japan

Abstract:

See more of: Copper Electrodeposition Fundamentals
See more of: E7: Processing, Materials, and Integration of Damascene and 3D Interconnects 5
See more of: Dielectric and Semiconductor Materials, Devices, and Processing
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