2085
Analysis of Cu(I) Complexes in Copper Sulfate Electroplating Solution By Using Reaction Kinetics With a Chelate Reagent

Wednesday, October 30, 2013: 08:40
Union Square 21, Tower 3, 4th Floor (Hilton San Francisco Union Square)
Hiroaki Noma, Ph.D. , National Institute of Advanced Industrial Science and Technology (AIST), Tosu, Japan
Toshiaki Koga, Ph.D. , National Institute of Advanced Industrial Science and Technology (AIST)
Chieko Hirakawa, B.A. , National Institute of Advanced Industrial Science and Technology (AIST)
Kazuhiro Nonaka, Ph.D. , National Institute of Advanced Industrial Science and Technology (AIST)
Kazuhisa Shobu, Ph.D. , National Institute of Advanced Industrial Science and Technology (AIST)

Abstract:

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