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Structural Features of Nano-Scale Damascene Copper Lines After Annealing in Wide Temperature Range

Tuesday, October 29, 2013: 15:20
Union Square 21, Tower 3, 4th Floor (Hilton San Francisco Union Square)
Tatyana Konkova, Ph.D. , Department of Materials Science and Engineering, Ibaraki University, Hitachi-shi, Japan
Sergey Mironov, Ph.D. , Department of Materials Processing, Graduate School of Engineering, Tohoku University
Yiqing Ke, Ph.D. , Graduate School of Science and Engineering, Ibaraki University
Jin Onuki, Ph.D., Professor , Department of Materials Science and Engineering, Ibaraki University

Abstract:

See more of: Copper Damascene Interconnections
See more of: E7: Processing, Materials, and Integration of Damascene and 3D Interconnects 5
See more of: Dielectric and Semiconductor Materials, Devices, and Processing
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