2215
(Invited) Low Temperature Direct Bonding 3D Stacking Technologies for High Density Device Integration

Monday, October 28, 2013: 10:30
Continental 7, Tower 3, Ballroom Level (Hilton San Francisco Union Square)
Lea Di Cioccio , MINATEC, Grenoble, France
Ionut Radu , Soitec
Gweltaz Gaudin , Soitec
Thomas Lacave , MINATEC
Floriane Baudin , MINATEC
Mariam Sadaka , Soitec
Thomas Signamarcheix , MINATEC

Abstract:

See more of: Back-end Processing 1
See more of: E12: ULSI Process Integration 8
See more of: Dielectric and Semiconductor Materials, Devices, and Processing
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