2067
Modeling the Bottom-Up Filling of Through-Silicon Vias Through Suppressor Adsorption/Desorption Mechanism

Tuesday, October 29, 2013: 09:20
Union Square 21, Tower 3, 4th Floor (Hilton San Francisco Union Square)
Liu Yang , Vrije Universiteit Brussel, Leuven, Belgium
Aleksandar Radisic, PhD , imec Belgium
Johan Deconinck , Vrije Universiteit Brussel
Philippe M. Vereecken , imec, Belgium, Leuven, Belgium

Abstract:

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