2092
Analysis of Addtive Role for Copper Electroplating Using Microfluidic Channel

Wednesday, October 30, 2013: 11:20
Union Square 21, Tower 3, 4th Floor (Hilton San Francisco Union Square)
Masanori Hayase, Doctor of Engineering , Tokyo University of Science, Noda, Chiba, Japan
Yu Agarita, Bachelor , Tokyo University of Science
Haruki Egoshi, Bachelor , Tokyo University of Science

Abstract:

  • E7-2092 (308.8KB) - Abstract Text
See more of: Copper Electrodeposition Fundamentals
See more of: E7: Processing, Materials, and Integration of Damascene and 3D Interconnects 5
See more of: Dielectric and Semiconductor Materials, Devices, and Processing
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