2091
In-Situ Analysis of Peg Surface Adhesion On Cu

Wednesday, October 30, 2013: 11:00
Union Square 21, Tower 3, 4th Floor (Hilton San Francisco Union Square)
Ui-Hyoung Lee, Ph.D. , Samsung Electronics, Thin Film Technology Team, Hwasung, South Korea
Jinho Choi, Undergraduate , Samsung Electronics, Thin Film Technology Team
Jaihyung Won, Ph.D. , Samsung Electronics, Thin Film Technology Team
Hyo-Jong Lee, Ph.D. , Dong-A University
Hun-Joon Sohn, Ph.D. , Seoul National University
Tak Kang, Ph.D. , Seoul National University

Abstract:

  • E7-2091 (3479.9KB) - Abstract Text
See more of: Copper Electrodeposition Fundamentals
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See more of: Dielectric and Semiconductor Materials, Devices, and Processing
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