2090
Diallylamine Levelers Side Chains Effect On Copper Via Filling

Wednesday, October 30, 2013: 10:40
Union Square 21, Tower 3, 4th Floor (Hilton San Francisco Union Square)
Yasutaka Yamada, Master , Osaka Prefecture University, sakai-city Osaka, Japan
Kazuo Kondo, Ph.D. , Osaka Prefecture University, Sakai, Japan
Minoru Takeuchi, B.S. , Nittobo Medical
Takeyasu Saito, Ph.D. , Osaka Prefecture University
Naoki Okamoto, D.Eng. , Osaka Prefecture University
Masaru Bunya , Nittobo Medical
Masayuki Yokoi , Osaka Prefecture University

Abstract:

  • E7-2090 (2788.7KB) - Abstract Text
See more of: Copper Electrodeposition Fundamentals
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