2089
Copper Plating Uniformity On Resistive Substrate With Segmented Anode

Wednesday, October 30, 2013: 10:20
Union Square 21, Tower 3, 4th Floor (Hilton San Francisco Union Square)
Liu Yang , Vrije Universiteit Brussel, Leuven, Belgium
Aleksandar Radisic, PhD , imec Belgium
Johan Deconinck , Vrije Universiteit Brussel
Philippe M. Vereecken , imec, Belgium, Leuven, Belgium

Abstract:

  • E7-2089 (106.7KB) - Abstract Text
See more of: Copper Electrodeposition Fundamentals
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