2088
Impurity-Induced Tin Incorporation During Copper Electrodeposition

Wednesday, October 30, 2013: 10:00
Union Square 21, Tower 3, 4th Floor (Hilton San Francisco Union Square)
Sathana Kitayaporn , IBM T.J. Watson Research Center, Yorktown Heights, NY
Marinus Hopstaken , IBM T.J. Watson Research Center
Qiang Huang , IBM, T. J. Watson Research Center, Yorktown Heights, NY
Brett C. Baker-O'neal , IBM T.J. Watson Research Center, Yorktown Heights, NY

Abstract:

See more of: Copper Electrodeposition Fundamentals
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