2060
Reduction of Thermal Expansion Coefficient of Electrodeposited Copper　for TSV

Monday, October 28, 2013: 15:40
Union Square 21, Tower 3, 4th Floor (Hilton San Francisco Union Square)
Kazuo Kondo, Ph.D. , Osaka Prefecture University, Sakai, Japan
Shingo Mukahara, BS , Osaka Prefecture University
Taro Hayashi, M.S. , Osaka Prefecture University, Sakai, Osaka, Japan
Minoru Takeuchi, B.S. , Nittobo Medical
Takeyasu Saito, Ph.D. , Osaka Prefecture University
Naoki Okamoto, D.Eng. , Osaka Prefecture University

Abstract:

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