1868
Physical, Electrical, and Reliability Characteristics of Multi-Step Deposition-Annealed HfO2 Film

Wednesday, October 30, 2013
Grand Ballroom, Tower 2, Grand Ballroom Level (Hilton San Francisco Union Square)
Yi-Lung Cheng , National Chi-Nan University, Nan-Tou, Taiwan
Cheng-Yang Hsieh, Master , National Chi-Nan University
Tian-Cih Bo, Master , National Chi-Nan University
Chang-Sian Wu , National Chi-Nan University
Jian-Run Lin , National Chi-Nan University

Abstract:

  • E2-1868 (126.3KB) - Abstract Text
See more of: Poster Session
See more of: E2: Atomic Layer Deposition Applications 9
See more of: Dielectric and Semiconductor Materials, Devices, and Processing
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