Electroless Deposition: Principles and Applications 3 - Part II

Monday, May 12, 2014: 14:00-15:40
Orange, Ground Level (Hilton Orlando Bonnet Creek)
Chairs:
Nikolay Dimitrov and Luca Magagnin
14:00
526
Electroless Copper Metallization for Improving Li-Ion Batteries Performances
M. Spreafico (Politecnico di Milano), P. Cojocaru, F. Triulzi, M. Apostolo (Solvay Specialty Polymers), and L. Magagnin (Politecnico di Milano)
14:20
527
Contact Resistance Measurements for Electrodes on Silicon Prepared by Autocatalytic Electroless Metallization Using Metal Nanoparticles
Y. Orita (Murata Co., Ltd.), H. Atsushiba, M. Enomoto (University of Hyogo), T. Kimura (Japan Fine Tech Co., Ltd.), N. Fukumuro (University of Hyogo), H. Takagami, K. Kato (Murata Co., Ltd.), S. Sakamoto (University of Hyogo, Nippon Oikos Co., Ltd.), M. Hirata (Nippon Oikos Co., Ltd.), and S. Yae (University of Hyogo)
 
528
Structure and Phase Distribution of the Electrophortically Deposited Hydroxyapatite and Cerium Oxide (Cancelled)
15:00
529
Synthesis of Electroless Cu-Ni-Mo-P/Al2O3 for Glycerol Hydrogenolysis to Propan-1,2-diol
O. Elendu, Y. D. Yeboah (Florida State University), and E. E. Kalu (Florida A&M University - Florida State University College of Engineering)
15:20
530
An AFM Evaluation of Rhenium-Nickel Electrodeposit Nucleation on Copper
S. K. Mondal, F. Contu (National Corrosion Center at TEES of Texas A&M University), B. Ewers, J. D. Batteas (Department of Chemistry, Texas A&M University), and S. R. Taylor (National Corrosion Center at TEES of Texas A&M University)
See more of: D2: Electroless Plating: Principles and Applications 3
See more of: Electrochemical/Electroless Deposition
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