Reliability of More-Than-Moore Devices

Wednesday, May 14, 2014: 14:00-16:40
Union, Ground Level (Hilton Orlando Bonnet Creek)
Chairs:
Yaw S. Obeng and Sylvia Thomas
14:00
1418
Impact of Thermal History on Grain Size and Grain Size Distribution of Thermally Cycled Cu-Tsvs
J. B. Marro (Clemson University, University of Central Florida), C. A. Okoro, Y. S. Obeng (NIST), and K. A. Richardson (University of Central Florida)
14:40
1419
(Invited) Framework for Structural, Processing, and Environmental Assessment of Micro to Nano Scaled Integrated Circuit Structures
S. Thomas, B. Bell, N. Alcantar, D. Durham, and S. Perez (University of South Florida)
15:20
Break
 
1420
Reliability Performances of BST Capacitors for Impedance Tuning Applications (Cancelled)
 
1421
Study of HKMG Stack  Interface Engineer Applicable to 22nm/16nm Finfet Mosfet (Cancelled)
See more of: N3: More-Than-Moore
See more of: Dielectric Science and Materials
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