Electroless Deposition of Cu-Mn Alloy
Currently, the state-of-the-art method for depositing Cu-Mn alloys is sputter deposition with Mn content generally above a few atomic percent [2,3]. Compared to sputter deposition, electroless deposition has numerous advantages such as simplicity, low cost and faster deposition rate. Therefore, it is of great interest to develop an electroless process for depositing Cu-Mn alloy.
In this study, we report electroless deposition of Cu-Mn. The Mn incorporated was found to be ‘mobile’, a prerequisite for its application in interconnect metallization. It was also observed that Mn was incorporated during electroless Cu-Mn deposition at potentials that are much more anodic to its standard reduction potential (-1.18 V vs. SHE). To further our understanding of the electroless Cu-Mn deposition, a combination of voltammetry and quartz crystal microbalance were used to unravel the Mn deposition mechanism.
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