New ALD Materials and Processes I

Tuesday, 7 October 2014: 15:40-17:20
Expo Center, 1st Floor, Universal 16 (Moon Palace Resort)
Chairs:
J. W. Elam and Christian Dussarrat
15:40
1614
Manganese Precursor Selection and the Thermal Atomic Layer Deposition of Copper/Manganese Alloy Films
L. C. Kalutarage (Wayne State University), S. B. Clendenning (Intel Corporation), and C. H. Winter (Wayne State University)
16:20
1615
Promoted Platinum Catalytic Activity and Thermal Stability with Nano-Scale Cobalt Oxide Coating via Atomic Layer Deposition
K. Cao, B. Huang, Y. Zhang, X. Liu, B. Shan, and R. Chen (Huazhong University of Science and Technology)
16:40
1616
Flash-Lamp-Enhanced Atomic Layer Deposition of Thin Films
T. Henke, M. Knaut, C. Hossbach, M. Geidel (Technische Universität Dresden), L. Rebohle (Helmholtz Zentrum), M. Albert (Technische Universität Dresden), W. Skorupa (Helmholtz Zentrum), and J. W. Bartha (Technische Universität Dresden)
See more of: P1: Atomic Layer Deposition Applications 10
See more of: Electronic Materials and Processing
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