Superconformal Film Growth

Moffat, Thomas

Superconformal Film Growth

Tuesday, 26 May 2015: 08:00-12:30

PDR 4 (Hilton Chicago)

Chairs:

Thomas Moffat , Rohan Akolkar and Qiang Huang

08:00

1160

Microvia and through-Hole Filling By Electroplating for Electronic Circuit Fabrication

W. P. Dow (National Chung Hsing University)

08:40

1161

Theory of Co-Adsorption and Its Application to Copper Superfilling

R. Liske, R. Krause, B. Uhlig, L. Gerlich, S. Bott, M. Wislicenus (Fraunhofer Institute for Photonic Microsystems), and A. Preusse (Globalfoundries Dresden Module One LLC & Co.KG)

09:00

1162

Stochastic Modeling of Organic Additives in Cu Electroplating

L. Yang (imec, Vrije Universiteit Brussel), A. Radisic (imec), J. Deconinck (Vrije Universiteit Brussel), and P. M. Vereecken (imec, Centre of Surface Chemistry and Catalysis, K.U. Leuven)

09:20

Intermission

09:50

1163

Smart Polymers for Future Damascene Applications: Combining Bottom-up and Levelling Capabilities

H. Nguyen, F. Stricker, D. Lechner, J. Furrer, V. Grimaudo, P. Moreno-García, A. Riedo, M. Neuland, M. Tulej, P. Wurz, and P. Broekmann (University of Bern)

1164

Microvia Filling in an Acidic Copper Planting Bath with Insoluble Anodes (Cancelled)

10:50

1165

Evaluating the Performance of 2-Mercapto-5-Benzimidazolesulfonic Acid in Controllable Electro-Healing Cracks in Nickel

X. G. Zheng, Y. N. Shi, and K. Lu (Institute of Metal Research, Chinese Academy of Sciences)

11:10

1166

Utilizing Inhibitor Molecules in Low Temperature CVD to Control Thin Film Conformality, Nucleation, and Surface Morphology

J. R. Abelson (University of Illinois at Urbana-Champaign)

11:50

1167