Superconformal Film Growth

Tuesday, 26 May 2015: 08:00-12:30
PDR 4 (Hilton Chicago)
Thomas Moffat , Rohan Akolkar and Qiang Huang
Theory of Co-Adsorption and Its Application to Copper Superfilling
R. Liske, R. Krause, B. Uhlig, L. Gerlich, S. Bott, M. Wislicenus (Fraunhofer Institute for Photonic Microsystems), and A. Preusse (Globalfoundries Dresden Module One LLC & Co.KG)
Stochastic Modeling of Organic Additives in Cu Electroplating
L. Yang (imec, Vrije Universiteit Brussel), A. Radisic (imec), J. Deconinck (Vrije Universiteit Brussel), and P. M. Vereecken (imec, Centre of Surface Chemistry and Catalysis, K.U. Leuven)
Smart Polymers for Future Damascene Applications: Combining Bottom-up and Levelling Capabilities
H. Nguyen, F. Stricker, D. Lechner, J. Furrer, V. Grimaudo, P. Moreno-García, A. Riedo, M. Neuland, M. Tulej, P. Wurz, and P. Broekmann (University of Bern)
Microvia Filling in an Acidic Copper Planting Bath with Insoluble Anodes (Cancelled)
Evaluating the Performance of 2-Mercapto-5-Benzimidazolesulfonic Acid in Controllable Electro-Healing Cracks in Nickel
X. G. Zheng, Y. N. Shi, and K. Lu (Institute of Metal Research, Chinese Academy of Sciences)
Using Graphene As a Conducting Layer and Barrier Layer for High Aspect Ratio through Silicon Via Filling
W. Y. Zeng, S. C. Chang, and W. P. Dow (National Chung Hsing University)