(Invited) Divide Et Impera: Towards New Frontiers with Atomic Layer Etching
Separation of complex continuous reactive ion etch (RIE) processes into simple, individual steps has profound implications. It is interesting to note the parallels to advanced mathematical algorithm development where so called “Divide and Conquer” algorithms break a complex problem into two or more sub-problems, until they can be solved and combined to give a solution to the original problem. In this talk we will discuss ALE in the context of the fundamentals of RIE, show the common roots and where ALE goes beyond RIE to allow new levels of performance and reduced complexity. The latter drives the need and opens the opportunity for better understanding of the surface reactions such as adsorption and sputtering. Latest experimental results will be shown for how dividing RIE processes into individual steps allows to conquer new heights of etch performance.
- K.J. Kanarik, T. Lill, E. Hudson, S. Tan, S. Sriraman, J. Marks, V. Vahedi, R.A. Gottscho; J. Vac. Sci. Technol. A 33, 020802 (2015)
- G.S. Oehrlein, D. Metzler, C. Li; ESC J. Solid State Technol. 4, N5041 (2015)
- T. Faraz, F. Roozeboom, H.C.M. Knoops, W.M.M. Kessels; ESC J. Solid State Technol. 4, N5032 (2015)
- S. Tan, W. Yang, K.J. Kanarik, T. Lill, V. Vahedi, J. Marks, R.A. Gottscho; ESC J. Solid State Technol. 4, N5010 (2015)