MEMS Applications

Wednesday, October 14, 2015: 10:00-11:40
103-B (Phoenix Convention Center)
Chair:
Shinichi Takagi
10:00
1101
(Keynote) Heterogeneous Integration of MEMS by Adhesive Bonding
M. Esashi (Tohoku University) and S. Tanaka (Tohoku University)
10:40
1102
CMOS and NEMS Hybrid Architectures
T. Ernst, I. Ouerghi, W. Ludurczak, J. Arcamone, L. Duraffourg, E. Ollier, J. Philippe (Univ. Grenoble Alpes,CEA-LETI), and S. Hentz (Univ. Grenoble Alpes,CEA-LETI)
11:10
1103
(Invited) Observation of Stress Responses of Bacteria Confined in a MEMS Microfluidic Chip
Y. Nishimura, M. Ishida, K. Sawada (Toyohashi University of Technology), H. Ishii (Toyohashi University of Technology), K. Machida (NTT Advanced Technology Corporation, Tokyo Institute of Technology), K. Masu (Tokyo Institute of Technology), C. Wang, K. Iida, M. Saito (Graduate School of Medical Sciences, Kyushu University), and S. Yoshida (Graduate School of Medical Sciences, Kyushu University)
See more of: G04: ULSI Process Integration 9
See more of: Electronic Materials and Processing
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