Lateral MOSFETs were fabricated on the Si-face of p-type 4H-SiC epitaxial layers doped at ~1x1016cm-3. Sb was implanted in the channel region with 80 keV at room temperature with dose of 2.5x1013cm-2, which results in a Gaussian profile with a depth of around 30nm below the surface of SiC. This was followed by post-implantation activation annealing at 1650°C using a graphitic carbon cap layer. Next, dry oxidation at 1150°C for 10 hours was performed followed by post-oxidation annealing using a planar diffusion source (Techneglas, GS-139) composed of boric oxide (B2O3) in a gas mixture of Ar (50sccm) and O2 (5sccm) at 950°C for 30 mins. Samples that received only boron annealing are referred to as 'BSG only' and samples underwent both Sb counter-doping and boron annealing are referred to as 'Sb+BSG'. Results for these samples are compared with standard NO-annealed devices in Table Ⅰ.
The SIMS result in Fig. 1 shows B distributes throughout the oxide with a concentration of ~1x1022cm-3 and decreases as it reaches SiC. Threshold voltage and sub-threshold slope were characterized by Id-Vg measurement at room temperature and field-effect mobility was extracted from the transconductance of Id-Vg curve. Linear and log scale of Id-Vg curves in Fig. 2 and Fig. 3 demonstrate that 'Sb+BSG' tunes the threshold voltage to a more desirable value of ~2V along with a better sub-threshold slope than standard NO annealing. Fig. 4 shows a significant mobility improvement for 'Sb+BSG' at both high field due to the BSG passivation effect and low field due to the Sb counter-doping effect with a peak value of ~180cm2/V∙s compared to 'BSG only' with a peak mobility of ~140cm2/V∙s. In order to investigate the boron passivation effect on interface traps, C-V and constant capacitance deep level transient spectroscopy (CCDLTS) measurements were performed on the companion BSG capacitors. The interface trap density of 'NO' was determined to be ~2.5 times higher than that of 'BSG' for very shallow energy traps (<0.2 eV) from C-V measurements and ~1.5 times higher for the energy trap distributions centered at 0.15 eV and 0.39 eV by CCDLTS, as shown in Figs. 5 and 6. The mechanism of boron passivation has been suggested to be oxide stress relaxation by the reduction of required oxygen bonds due to the occupation of Si site by B . In this presentation, further details of the nature of transport and mobility behavior in BSG gated channels will be presented as a function of temperature.
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