G02 Poster Session

Tuesday, 30 May 2017: 18:00-20:00
Grand Ballroom (Hilton New Orleans Riverside)
Chairs:
Evgeni Gusev and P. J. Timans
1276
Thermal Budget Reduction in Triple Gate Oxide Process by Wet Etch Technique
H. Tai, H. Y. Liao, H. A. Chen, P. T. Tou, W. T. Liu, M. C. Lu, and T. H. Ying (Powerchip Technology Corporation)
1277
Enhancement of Light-to-Dark Current Ratio Via Coupling Effect for MIS (p) Tunnel Diode Photo Sensors
W. T. Hou, W. C. Kao, and J. G. Hwu (National Taiwan University)
 
1278
Reliability Characteristics of Low Dielectric Constant Materials Under Mechanical-Electrical Stress (Cancelled)
1279
Controlling the Electrochemical Etching of Pores with High Aspect Ratio at the Submicrometer Scale in Silicon
G. Polito, C. Cozzi, and G. Barillaro (University of Pisa)
See more of: G02: Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 7
See more of: Electronic Materials and Processing
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