G02 Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 7

Lead Organizer: Fred Roozeboom (Eindhoven University of Technology)

Co-organizers: Hemanth Jagannathan (IBM Research) , Kuniyuki Kakushima (Tokyo Institute of Technology) , P. J. Timans (Thermal Process Solutions Ltd.) , E. P. Gusev (Qualcomm Technologies, Inc.) , Zia Karim (AIXTRON Inc) and Stefan De Gendt (Imec vzw)

Monday, 29 May 2017

08:30-10:00


G02 Keynote
Churchill B2
Chair(s): Fred Roozeboom, Kuniyuki Kakushima, Hemanth Jagannathan and P. J. Timans

10:00-12:00


FEOL Materials and Process Technology
Churchill B2
Chair(s): Hemanth Jagannathan and Fred Roozeboom

14:00-15:40


Contact and MOL Technology
Churchill B2
Chair(s): Hemanth Jagannathan and Stefan De Gendt

Tuesday, 30 May 2017

08:00-09:55


BEOL Material and Process Technology
Churchill B2
Chair(s): Kuniyuki Kakushima and Stefan De Gendt

09:55-10:40

10:40-12:20


New Materials and Device Architectures
Churchill B2
Chair(s): Zia Karim and P. J. Timans

14:00-17:00


Materials and Processes for Silicon Technology
Churchill B2
Chair(s): Zia Karim, P. J. Timans and Fred Roozeboom

18:00-20:00


G02 Poster Session
Grand Ballroom
Chair(s): Evgeni Gusev and P. J. Timans