Materials and Processes for Silicon Technology

Tuesday, 30 May 2017: 14:00-17:00
Churchill B2 (Hilton New Orleans Riverside)
P. J. Timans
Controlled Fabrication of High-Aspect-Ratio Microstructures in Silicon at Etching Rates Beyond State-of-the-Art Microstructuring Technologies
C. Cozzi, G. Polito (University of Pisa), K. W. Kolasinski (West Chester University), and G. Barillaro (University of Pisa)
Electrolyzed Sulfuric Acid Application in Semiconductor Cleaning Processes: An Advanced Substitution of SPM Cleaning
J. H. Ahn (SK Hynix), P. D. Kim (SK Hyinx), S. C. Hwang, J. Seo, S. Lee (SK Hynix), Y. Ogawa (Kurita Water Industries LTD.), J. Ida, Y. Sasaki (Kurita Water Industries, LTD), T. Nagai (Kurita Water Industries LTD.), and T. Otsu (Kurita Water Industries, LTD)
Hydrogen-Induced Crystallization of Germanium Films at Low Temperature Using an RF-PECVD Reactor
G. Dushaq, M. Rasras (Masdar Institute of Science and Technology), and A. Nayfeh (Masdar Institue of Science and Technology, Abu Dhabi, UAE)
Ultra-High Purity Hydrazine Delivery for Low Temperature Metal Nitride ALD
D. Alvarez Jr., J. Spiegelman, R. Holmes, K. Andachi (RASIRC), M. Raynor, and H. Shimizu (Matheson Tri-Gas)
The Role of Polysilicon Slurry and Its Application in 7nm CMP
T. F. Chao, D. Penigalapati (GlobalFoundries), J. C. Yang (Globalfoundries US), H. Huang (GlobalFoundries), and D. R. Koli (GLOBALFOUNDRIES Inc)
Multi-Wavelength Raman Characterization of Epitaxial Silicon Wafers for In-Line ProcessĀ Characterization and Monitoring Applications (Cancelled)