Materials and Processes for Silicon Technology

Tuesday, 30 May 2017: 14:00-17:00
Churchill B2 (Hilton New Orleans Riverside)
Chair:
P. J. Timans
14:00
1269
(Invited) Atomic Layer Etching of SiO2 and Other Materials Using Plasma Process Sequences
G. S. Oehrlein (University of Maryland)
14:40
1270
Controlled Fabrication of High-Aspect-Ratio Microstructures in Silicon at Etching Rates Beyond State-of-the-Art Microstructuring Technologies
C. Cozzi, G. Polito (University of Pisa), K. W. Kolasinski (West Chester University), and G. Barillaro (University of Pisa)
15:00
1271
Electrolyzed Sulfuric Acid Application in Semiconductor Cleaning Processes: An Advanced Substitution of SPM Cleaning
J. H. Ahn (SK Hynix), P. D. Kim (SK Hyinx), S. C. Hwang, J. Seo, S. Lee (SK Hynix), Y. Ogawa (Kurita Water Industries LTD.), J. Ida, Y. Sasaki (Kurita Water Industries, LTD), T. Nagai (Kurita Water Industries LTD.), and T. Otsu (Kurita Water Industries, LTD)
15:20
Break
15:40
1272
Hydrogen-Induced Crystallization of Germanium Films at Low Temperature Using an RF-PECVD Reactor
G. Dushaq, M. Rasras (Masdar Institute of Science and Technology), and A. Nayfeh (Masdar Institue of Science and Technology, Abu Dhabi, UAE)
16:00
1273
Ultra-High Purity Hydrazine Delivery for Low Temperature Metal Nitride ALD
D. Alvarez Jr., J. Spiegelman, R. Holmes, K. Andachi (RASIRC), M. Raynor, and H. Shimizu (Matheson Tri-Gas)
16:20
1274
The Role of Polysilicon Slurry and Its Application in 7nm CMP
T. F. Chao, D. Penigalapati (GlobalFoundries), J. C. Yang (Globalfoundries US), H. Huang (GlobalFoundries), and D. R. Koli (GLOBALFOUNDRIES Inc)
 
1275
Multi-Wavelength Raman Characterization of Epitaxial Silicon Wafers for In-Line Process Characterization and Monitoring Applications (Cancelled)
See more of: G02: Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 7
See more of: Electronic Materials and Processing
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