Pulse and Pulse Reverse Electrolytic Processes 2

Tuesday, 30 May 2017: 10:00-12:40
Marlborough B (Hilton New Orleans Riverside)
Elizabeth J Podlaha and Rajeswaran Radhakrishnan
(Invited) Electrochemical Atomic Layer Deposition: Metal Deposition One Atomic Layer at a Time Enabled By Potential Pulsing & Self-Limiting Growth
R. Akolkar (Case Western Reserve University), Y. Dordi, A. Joi (Lam Research Corporation), K. Venkatraman, and R. Gusley (Case Western Reserve University)
Effects of Pulse-Reverse Currents on Nickel Deposited from Sulphamate Solutions
B. Çetinöz (Middle East Technical University), M. Erdogan (Yildirim Beyazit University), M. S. Aras, and I. Karakaya (Middle East Technical University)
New Opportunities in Pulse Plating Via Self-Terminated Electrodeposition Reactions
T. P. Moffat (National Institute of Standards and Technology), Y. Liu (LAM Research), S. H. Ahn (National Institute of Standards and Technology), N. L. Ritzert (NIST, National Institute of Standards and Technology), R. Wang (NIST), D. Gokcen (National Institute of Standards and Technology), C. Hangarter (U.S. Naval Research Laboratory), and U. Bertocci (National Institute of Standards and Technology)
Pulse and DC Electrodeposition of Ni-W-TiO2 Thin Film Composites
Y. Zhang and E. J. Podlaha (Northeastern University)
Pulse Reverse Plating of Zn-Ni on Aluminum and Steel
J. Xu, T. D. Hall, M. Inman, E. J. Taylor, and S. Snyder (Faraday Technology, Inc.)