Pulse and Pulse Reverse Electrolytic Processes 2

Tuesday, 30 May 2017: 10:00-12:40
Marlborough B (Hilton New Orleans Riverside)
Chairs:
Elizabeth J Podlaha and Rajeswaran Radhakrishnan
10:00
1180
(Invited) Electrochemical Atomic Layer Deposition: Metal Deposition One Atomic Layer at a Time Enabled By Potential Pulsing & Self-Limiting Growth
R. Akolkar (Case Western Reserve University), Y. Dordi, A. Joi (Lam Research Corporation), K. Venkatraman, and R. Gusley (Case Western Reserve University)
10:40
1181
Pulse Potential Deposition - an Experimental Protocol for Growth of High Quality Thin Films Via Surface Limited Red-Ox Replacement Reaction
S. Brankovic, W. Dongjun, and D. Solanki (University of Houston)
11:00
1182
Effects of Pulse-Reverse Currents on Nickel Deposited from Sulphamate Solutions
B. Çetinöz (Middle East Technical University), M. Erdogan (Yildirim Beyazit University), M. S. Aras, and I. Karakaya (Middle East Technical University)
11:20
1183
New Opportunities in Pulse Plating Via Self-Terminated Electrodeposition Reactions
T. P. Moffat (National Institute of Standards and Technology), Y. Liu (LAM Research), S. H. Ahn (National Institute of Standards and Technology), N. L. Ritzert (NIST, National Institute of Standards and Technology), R. Wang (NIST), D. Gokcen (National Institute of Standards and Technology), C. Hangarter (U.S. Naval Research Laboratory), and U. Bertocci (National Institute of Standards and Technology)
11:40
1184
Codeposition of Nickel-Phosphorus Alloys Reinforced with Boron Carbide Microparticles: Direct and Pulse Plating
R. Bernasconi and L. Magagnin (Politecnico di Milano)
12:00
1185
Pulse and DC Electrodeposition of Ni-W-TiO2 Thin Film Composites
Y. Zhang and E. J. Podlaha (Northeastern University)
12:20
1186
Pulse Reverse Plating of Zn-Ni on Aluminum and Steel
J. Xu, T. D. Hall, M. Inman, E. J. Taylor, and S. Snyder (Faraday Technology, Inc.)
See more of: F05: Pulse and Pulse Reverse Electrolytic Processes
See more of: Electrochemical Engineering
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