The GeSn layers were grown on a Ge-buffered Si wafer [3] in a reduced pressure chemical vapor deposition tool using digermane and tin tetrachloride as Ge and Sn precursors. Two batches of detectors were fabricated; one based on GeSn on Ge and the other one based on suspended GeSn layers. Photolithography and ICP dry etching were used for patterning the detectors and the Ge underneath were removed by anisotropic selective etching using CF4 gas. XRD and RBS measurements indicate Sn contents of more than 10% without any Sn out diffusion. Raman spectroscopy shows the strain relaxation through Ge under‑etching and layer release. The temperature dependence dependent photoluminescence spectra shown in Fig. 1 is in accordance with a direct band gap transitions of the GeSn layers around 0.5 eV. The effects of layer suspension on the absorption spectra and the photo response of the detectors will be discussed in the presentation.
Fig. 1) Temperature dependence photoluminescence spectra of GeSn layer with 12% Sn content
Acknowledgements:
This work was supported by the Swedish Foundation for Strategic Research (SSF) and Vetenskapsrådet (VR).
References:
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