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(Invited) Challenges in 3D Integration

Tuesday, May 14, 2013: 16:20
Norfolk, Mezzanine Level (Sheraton)
Mitsumasa Koyanagi, PhD , Tohoku University, Sendai, Japan
Kang Wook Lee , Tohoku University
Takafumi Fukushima , Tohoku University
Tetsu Tanaka , Tohoku University

Abstract:

See more of: 3D Integration/ReRAM/MEMS
See more of: E5: Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications 3
See more of: Dielectric and Semiconductor Materials, Devices, and Processing
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