2239
Optimization of Cu Damascene Electrodeposition Process in ULSI for Yield and Reliability Improvement
Wednesday, October 30, 2013: 08:40
Continental 7, Tower 3, Ballroom Level (Hilton San Francisco Union Square)
Ingrid Shao, PH.D
,
IBM T. J. Watson Research Center, Yorktown Heights, NY
Tien Cheng, Ph.D
,
IBM Semiconductor Research & Development Center
Paul Findeis, Ph.D
,
IBM Microelectronics Division
James Kelly
,
IBM Albany Nanotechnology Center, Albany, NY
Shafaat Ahmed
,
IBM Semiconductor Research & Development Center
Matthew Angyal
,
IBM Semiconductor Research & Development Center
Yiheng Xu, Ph.D
,
IBM Semiconductor Research & Development Center
B. Li
,
IBM Microelectronics Division
J. Tinkler
,
IBM Semiconductor Research & Development Center
Naftali Lustig, Ph.D
,
IBM Semiconductor Research & Development Center
Edward Engbrecht
,
IBM Semiconductor Research & Development Center
C. Truong
,
IBM Semiconductor Research & Development Center
M. Chudzik
,
IBM Semiconductor Research & Development Center
S. Grunow
,
IBM Semiconductor Research & Development Center
