Wednesday, October 30, 2013: 08:40-09:40
Continental 7, Tower 3, Ballroom Level (Hilton San Francisco Union Square)
08:40
Optimization of Cu Damascene Electrodeposition Process in ULSI for Yield and Reliability Improvement
Ingrid Shao, PH.D, IBM T. J. Watson Research Center;
Tien Cheng, Ph.D, IBM Semiconductor Research & Development Center;
Paul Findeis, Ph.D, IBM Microelectronics Division;
James Kelly, IBM Albany Nanotechnology Center;
Shafaat Ahmed, IBM Semiconductor Research & Development Center;
Matthew Angyal, IBM Semiconductor Research & Development Center;
Yiheng Xu, Ph.D, IBM Semiconductor Research & Development Center;
B. Li, IBM Microelectronics Division;
J. Tinkler, IBM Semiconductor Research & Development Center;
Naftali Lustig, Ph.D, IBM Semiconductor Research & Development Center;
Edward Engbrecht, IBM Semiconductor Research & Development Center;
C. Truong, IBM Semiconductor Research & Development Center;
M. Chudzik, IBM Semiconductor Research & Development Center;
S. Grunow, IBM Semiconductor Research & Development Center
09:00
ALD W CMP for HKMG
Tao Yang, Institute of Microelectronics of Chinese Academy of Sciences;
Guilei Wang, Institute of Microelectronics of Chinese Academy of Sciences;
Qiang Xu, Institute of Microelectronics of Chinese Academy of Sciences;
Yihong Lu, Institute of Microelectronics of Chinese Academy of Sciences;
Jiahan Yu, Institute of Microelectronics of Chinese Academy of Sciences;
Hushan Cui, Institute of Microelectronics of Chinese Academy of Sciences;
Jiang Yan, Institute of Microelectronics of Chinese Academy of Sciences;
Junfeng Li, Institute of Microelectronics of Chinese Academy of Sciences;
Chao Zhao, Institute of Microelectronics of Chinese Academy of Sciences
