1888
A Comprehensive Study of Thermal Stability on Microstructure and Residual Stress for ALD HfZrO2 Films at 28nm HKMG CMOS Applications

Friday, November 1, 2013: 10:40
Continental 8, Tower 3, Ballroom Level (Hilton San Francisco Union Square)
Chen-Kuo Chiang , United Microelectronics Corporation, Tainan, Taiwan
J. C. Chang , United Microelectronics Corporation
C. C. Chien , United Microelectronics Corporation
C. L. Yang , United Microelectronics Corporation
J. Y. Wu , United Microelectronics Corporation

Abstract:

  • E2-1888 (142.4KB) - Abstract Text
See more of: III-V and Silicon MOS
See more of: E2: Atomic Layer Deposition Applications 9
See more of: Dielectric and Semiconductor Materials, Devices, and Processing
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